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Custom High Modulus Aluminum SiC Composite Parts for Electronics

Custom High Modulus Aluminum SiC Composite Parts for Electronics

Custom Manufacturing

Send us your 2D/3D drawings, material requirements, dimensions, tolerances, and surface finish specifications. We can customize the structure and manufacturing process to meet your application needs.


  • High modulus aluminum composite with 21–30 vol% SiC
  • Density: 2.82–2.87 g/cm³
  • Elastic modulus: 100–125 GPa (±5 GPa)
  • Tensile strength: 470–500 MPa
  • Thermal conductivity: 150–180 W/m·K (±5 W/m·K)
  • Thermal expansion coefficient: (14–17) × 10⁻⁶/K (±1 × 10⁻⁶/K)
  • Custom dimensions, hole patterns, and surface finishes
  • Precision stamping and multi-stage forming
  • Dimensional and flatness inspection available
  • Custom manufacturing based on customer drawings

Our high modulus aluminum SiC composite parts combine lightweight construction, high stiffness, and good thermal conductivity. They are used in consumer electronics, heat dissipation components, and precision structural parts where low weight, dimensional stability, and reliable thermal performance are required.

Manufacturing Process

Material cutting → precision stamping → multi-stage forming → punching/trimming → flattening → cleaning → quality inspection

This process helps maintain consistent dimensions, flatness, and part quality during production.

Custom High Modulus Aluminum SiC Composite Parts for Electronics插图

OEM & Custom Manufacturing: Send your 2D DWG or 3D STEP drawings to info@hofengfab.com for a custom quote, or visit Hofengfab to explore our manufacturing capabilities.

CMM Inspection & Quality Control

For precision motor mounting parts, we pay close attention to mounting face flatness, hole positions, and bore alignment. CMM inspection can be used to verify critical dimensions and geometric tolerances against customer drawings, helping ensure a proper fit during assembly.

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